Kaya, Y. Et Al. 2012. A novel approach to diffusion bonding of copper to stainless steel. PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE , vol.226 , 478-484.

Kaya, Y., Kahraman, N., DURGUTLU, A., & Gulenc, B., (2012). A novel approach to diffusion bonding of copper to stainless steel. PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE , vol.226, 478-484.

Kaya, Y. Et Al. "A novel approach to diffusion bonding of copper to stainless steel," PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE , vol.226, 478-484, 2012

Kaya, Y. Et Al. "A novel approach to diffusion bonding of copper to stainless steel." PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE , vol.226, pp.478-484, 2012

Kaya, Y. Et Al. (2012) . "A novel approach to diffusion bonding of copper to stainless steel." PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE , vol.226, pp.478-484.

@article{article, author={Y. Kaya Et Al. }, title={A novel approach to diffusion bonding of copper to stainless steel}, journal={PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE}, year=2012, pages={478-484} }