Sancaktar, E. And Dilsiz, N. 1998. Thickness dependent conduction behavior of various particles for conductive adhesive applications. 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing , (New York, United States Of America), 90-95.

Sancaktar, E., & Dilsiz, N., (1998). Thickness dependent conduction behavior of various particles for conductive adhesive applications . 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (pp.90-95). New York, United States Of America

Sancaktar, E, And NURSEL DİLSİZ. "Thickness dependent conduction behavior of various particles for conductive adhesive applications," 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, New York, United States Of America, 1998

Sancaktar, E And Dilsiz, NURSEL. "Thickness dependent conduction behavior of various particles for conductive adhesive applications." 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing , New York, United States Of America, pp.90-95, 1998

Sancaktar, E. And Dilsiz, N. (1998) . "Thickness dependent conduction behavior of various particles for conductive adhesive applications." 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing , New York, United States Of America, pp.90-95.

@conferencepaper{conferencepaper, author={E Sancaktar And author={NURSEL DİLSİZ}, title={Thickness dependent conduction behavior of various particles for conductive adhesive applications}, congress name={3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing}, city={New York}, country={United States Of America}, year={1998}, pages={90-95} }