Manufacturing low density boards from waste cardboards containing aluminium

Murathan A. M., Murathan A. S., Guerue M., Balbaşı M.

MATERIALS & DESIGN, vol.28, no.7, pp.2215-2217, 2007 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 28 Issue: 7
  • Publication Date: 2007
  • Doi Number: 10.1016/j.matdes.2006.06.014
  • Journal Name: MATERIALS & DESIGN
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED)
  • Page Numbers: pp.2215-2217
  • Gazi University Affiliated: Yes

Abstract

We tried to recycle waste Tetra Pak cardboards, which contain aluminium as a step in the prevention of the environmental pollution caused by municipal solid wastes and as methods of achieving economical worth from these. The composite prepared with urea-formaldehyde resin was harder relative to that prepared with polyvinyl acetate based glue. The target cardboard density and thickness were 0.5 g/cm(3) and 3.0 cm, respectively. We were unable to obtain information on the effect of matrix: resin ratio on hardness of materials. Samples were easily damaged by water, suggesting that these materials were not suitable for use in high-humidity media. (c) 2006 Elsevier Ltd. All rights reserved.