Preparation of Novel Polyindene/Polyoxymethylene Blends and Investigation of Their Properties


Cabuk T. Z., SARI B., ÜNAL H. İ.

JOURNAL OF APPLIED POLYMER SCIENCE, cilt.117, sa.6, ss.3659-3664, 2010 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 117 Sayı: 6
  • Basım Tarihi: 2010
  • Doi Numarası: 10.1002/app.32276
  • Dergi Adı: JOURNAL OF APPLIED POLYMER SCIENCE
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Sayfa Sayıları: ss.3659-3664
  • Gazi Üniversitesi Adresli: Evet

Özet

In this study, the conducting homopolymer of indene was synthesized by a chemical polymerization method in a nonaqueous medium, and polyindene (PIn)/polyoxymethylene (POM) blends were prepared. The physical, chemical, thermal, and spectral properties of the synthesized homopolymer and their blends were investigated. The conductivities of Pin and the PIn/POM blends were measured with a four-probe technique. The conductivity of PIn was determined as 1.16 x 10(-5) S/cm, whereas the conductivities of the PIn/POM blends were determined to be in the range 3.16 x 10(-6) to 9.8 x 10(-6) S/cm, From Gouy scale magnetic susceptibility measurements, we found that PIn and the PIn/POM blends had polaron natures. The amount of Fe (milligrams per gram) in the PIn and PIn/POM structures were determined by inductively coupled plasma-optic emission spectrometry. Fourier transform infrared spectra were taken to analyze the structural properties of PIn and the PIn/POM blends. The thermal properties of PIn and PIn/POM blends were investigated with thermogravimetric analysis and differential scanning calorimetry analyses, and we found that they showed adequate thermal stability. According to the initial decomposition temperature among the blends, the blend including 16% PIn had the highest decomposition temperature with 244 degrees C. The morphological structures of the PIn, POM, and blends were clarified with scanning electron microscopy. (C) 2010 Wiley Periodicals, Inc. J Appl Polym Sci 117: 3659-3664, 2010