Thermal control of electronic components is a continuously emerging problem as power loads keep increasing. The present study is mainly focused on experimental and numerical investigation of impinging jet cooling of 18 (3 x 6 array) flash mounted electronic components under a constant heat flux condition inside a rectangular channel in which air, following impingement, is forced to exit in a single direction along the channel formed by the jet orifice plate and impingement plate. Copper blocks represent heat dissipating electronic components. Inlet flow velocities to the channel were measured by using a Laser Doppler Anemometer (LDA) system. Flow field observations were performed using a Particle Image Velocimetry (PIV) and thermocouples were used for temperature measurements. Experiments and simulations were conducted for Re 4000 8000 at fixed value of H 10 x D-h. Flow field results were presented and heat transfer results were interpreted using the flow measurement observations. Numerical results were validated with experimental data and it was observed that the results arc in agreement with the experiments.