Phase change material aided thermal scheming of high power LED: Effect of PCM with varying pitch of hexagonal fins

Ramesh T., Praveen A. S., Pillai P. B., SALUNKHE S. S.

Materials Research Innovations, cilt.26, sa.6, ss.331-340, 2022 (Scopus) identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 26 Sayı: 6
  • Basım Tarihi: 2022
  • Doi Numarası: 10.1080/14328917.2021.1984665
  • Dergi Adı: Materials Research Innovations
  • Derginin Tarandığı İndeksler: Scopus, Academic Search Premier, Aerospace Database, Chemical Abstracts Core, Communication Abstracts, Compendex, INSPEC, Metadex, Civil Engineering Abstracts
  • Sayfa Sayıları: ss.331-340
  • Anahtar Kelimeler: Heat sink, hexagonal fins, junction temperature, luminous flux, phase change material, thermal resistance
  • Gazi Üniversitesi Adresli: Evet

Özet

The current experimental investigation focused on the 16 W Light Emitting Diode (LED) with Phase Change Material (PCM)-filled heat sinks to augment consistency, high luminous flux and heat sink with low thermal resistance. Parameters such as input power, fin pitch value and quantity of fins were varied to study the heat transfer performance of the heat sink without and with PCM. Experimental results reveal that the hexagonal heat sink having a pitch of 10 mm performed well due to the increased melting rate of PCM as compared to other heat sinks. The thermal resistance of the H-10 heat sink with PCM was observed to be 3.3 °C/W, which is 73% lower than that of the H-10 heat sink without PCM at 16 W. The junction temperature enhancement ratio of 3.625 was observed for the H-10 heat sink with PCM at 16 W power input for SCT of 90 °C.