Influence of deposition pressure and power on characteristics of RF-Sputtered Mo films and investigation of sodium diffusion in the films


Akcay N., Sonmez N. A., Zaretskaya E. P., Ozcelik S.

Current Applied Physics, vol.18, no.5, pp.491-499, 2018 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 18 Issue: 5
  • Publication Date: 2018
  • Doi Number: 10.1016/j.cap.2018.02.014
  • Journal Name: Current Applied Physics
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Page Numbers: pp.491-499
  • Keywords: Mo films, RF magnetron sputtering, Ar gas pressure, Na diffusion, MOLYBDENUM THIN-FILMS, CU(IN,GA)SE-2 SOLAR-CELLS, BACK CONTACT, MICROSTRUCTURE, TEMPERATURE, RESISTIVITY, BILAYER, SURFACE, STRESS, GROWTH
  • Gazi University Affiliated: Yes

Abstract

© 2018 Korean Physical SocietyMo films deposited by DC sputtering are widely used as back contact in CIGS and CZTS based thin film solar cells. However, there have been only a few studies on the deposition of Mo films by RF sputtering method. In this context, Mo films on SLG substrates were prepared as a function of deposition pressure and power by using RF magnetron sputtering method to contribute to this shortcoming. Mo films were deposited at 250 °C substrate temperature by using 20, 15, 10 mTorr Ar pressures at 120 W RF power and 10 mTorr Ar pressure at 100 W RF power. Structural, morphological and reflectivity properties of RF-sputtered Mo films were clarified by XRD, AFM, FE-SEM and UV–Vis measurements. In addition, due to sodium incorporation from SLG substrate to the absorber layer through Mo back contact layer is so essential in terms of improving the conversion efficiency values of CIGS and CZTS thin film solar cell devices, the effects of Na diffusion in the films were analyzed with SIMS depth profile. The electrical properties of the films such as mobility, carrier density and resistivity were determined by Hall Effect measurements. It was found that Mo films prepared at 120 W, 10 mtorr and 250 °C substrate temperature and then annealed at 500 °C for 30 min, had resistivity as low as 10−5 Ω cm, as well as higher amount of Na incorporation than other films.