Selective etching of lead-free solder alloys: A brief review


Yahaya M. Z. , Nazeri M. F. M. , Salleh N. A. , KURT A., Kheawhom S., Illes B., ...More

MATERIALS TODAY COMMUNICATIONS, vol.33, 2022 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Review
  • Volume: 33
  • Publication Date: 2022
  • Doi Number: 10.1016/j.mtcomm.2022.104520
  • Journal Name: MATERIALS TODAY COMMUNICATIONS
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Compendex, INSPEC
  • Keywords: Solder alloys, Selective electrochemical etching, Morphologies, Lead-free solder, MECHANICAL-PROPERTIES, TENSILE CHARACTERISTICS, INTERMETALLIC COMPOUND, CORROSION BEHAVIOR, CYCLIC VOLTAMMETRY, SN-3.5AG SOLDER, COOLING RATE, SN, AG, MICROSTRUCTURE
  • Gazi University Affiliated: Yes

Abstract

This review covers recent applications of wet etching on solder alloys. Detailed characterization cases are pre-sented and discussed accordingly to highlight the process flow and applicability of conventional, deep etching, and selective etching techniques. A brief introduction of solder alloys and the concepts of each etching methods are described at the beginning of the review. The equipment setup and outcomes are presented for each char-acterization methods and discussed in parallel with the case studies from selected articles. Comparisons, results, and insights regarding each characterization methods are highlighted to observe the effectiveness, advantages, and future potential, especially on the selective electrochemical etching in solder joints characterization. The compilation of the latest literature, technical setup, and the main findings of the authors are the essential value of this review. It provides an in-depth understanding of conducting etchings on solder joints evaluations.