The use of electronic components is increasing day by day, and cooling of these components to work properly is an important task for researchers. However, many small enterprises do not have any involvement in the design of the finned surfaces used to remove heat from electronic circuits. As a result, electronic card faults are frequently encountered. Environmental conditions and the rate of heat to be removed directly affect the cooling type. In this study, an electronic driver unit of an HVAC (heating, ventilating, and air conditioning) system operated in a dusty environment within an enclosure is analyzed. Initially, experiments are performed to model the operational temperatures inside the enclosure. Subsequently, validation of the results was carried out by numerical methods. After the validation of the results, the effects of fin spacing, fin thickness, base thickness, and heat sink positions were simulated. According to the performance improvement results, the temperatures of the triacs are decreased by 10.1% and 13.2%, respectively.