Multipath Exploitation in Emitter Localization for Irregular Terrains


Creative Commons License

Dalveren Y., Kara A.

RADIOENGINEERING, cilt.28, sa.2, ss.473-482, 2019 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 28 Sayı: 2
  • Basım Tarihi: 2019
  • Doi Numarası: 10.13164/re.2019.0473
  • Dergi Adı: RADIOENGINEERING
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Sayfa Sayıları: ss.473-482
  • Anahtar Kelimeler: Emitter localization, multipath, scattering center, virtual sensor, Time Difference of Arrival (TDOA), SINGLE-SENSOR, TDOA, RANGE
  • Gazi Üniversitesi Adresli: Hayır

Özet

Electronic Support Measures (ESM) systems have many operational challenges while locating radar emitter's position around irregular terrains such as islands due to multipath scattering. To overcome these challenges, this paper addresses exploiting multipath scattering in passive localization of radar emitters around irregular terrains. The idea is based on the use of multipath scattered signals as virtual sensor through Geographical Information System (GIS). In this way, it is presented that single receiver (ESM receiver) passive localization can be achieved for radar emitters. The study is initiated with estimating candidate multipath scattering centers over irregular terrain. To do this, ESM receivers' Angle of Arrival (AOA) and Time of Arrival (TOA) information are required for directly received radar pulses along with multipath scattered pulses. The problem then turns out to be multiple-sensor localization problem for which Time Difference of Arrival (TDOA)-based techniques can easily be applied. However, there is high degree of uncertainty in location of candidate multipath scattering centers as the multipath scattering involves diffuse components over irregular terrain. Apparently, this causes large localization errors in TDOA. To reduce this error, a reliability based weighting method is proposed. Simulation results regarding with a simplified 3D model are also presented.