Pressure dependent conduction behavior of various particles for conductive adhesive applications


Sancaktar E., Dilsiz N.

3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, New York, United States Of America, 28 - 30 September 1998, pp.334-344 identifier identifier

  • Publication Type: Conference Paper / Full Text
  • Volume:
  • Doi Number: 10.1109/adhes.1998.742050
  • City: New York
  • Country: United States Of America
  • Page Numbers: pp.334-344

Abstract

The efficiency of electric conduction in particle filled conductive adhesives largely depends on the interparticle conduction. In order to gain insight into the pressure dependent conduction behavior with particles of different size, shape and type, the effects of external pressure on the filler resistance were measured by the four-point probe method using different conductive fillers. The following types of particles were used: Ni powder, Ni flake, Ag powder, Ni filament, magnetite spindles, and Cu particles. Non-filament particle size was in the range 0.7 to 44 microns. The filaments were 20 micron in diameter, and 160 or 260 micron in length. Particle treatment procedures assessed included silver coating using different methods, and the use of acid solutions including H3PO4, HF, and HCl to remove the surface oxide layer. Resistivity levels were measured using a nonconductive hollow cylinder plunger device developed in our laboratories.