Synthesis of thermoresponsive poly(N-isopropylacrylamide) brush on silicon wafer surface via atom transfer radical polymerization


Turan E., Demirci S., ÇAYKARA T.

THIN SOLID FILMS, vol.518, no.21, pp.5950-5954, 2010 (Journal Indexed in SCI) identifier identifier

  • Publication Type: Article / Article
  • Volume: 518 Issue: 21
  • Publication Date: 2010
  • Doi Number: 10.1016/j.tsf.2010.05.103
  • Title of Journal : THIN SOLID FILMS
  • Page Numbers: pp.5950-5954

Abstract

Thermoresponsive poly(N-isopropylacrylamide) [poly(NIPAM)] brush on silicon wafer surface was prepared by combining the self-assembled monolayer of initiator and atom transfer radical polymerization (ATRP). The resulting polymer brush was characterized by in situ reflectance Fourier transform Infrared spectroscopy, atomic force microscopy and ellipsometry techniques. Gel permeation chromatography determination of the number-average molecular weight and polydispersity index of the brush detached from the silicon wafer surface suggested that the surface-Initiated ATRP method can provide relatively homogeneous polymer brush Contact angle measurements exhibited a two-stage increase upon heating over the board temperature range 25-45 degrees C, which is in contrast to the fact that free poly(NIPAM) homopolymer in aqueous solution exhibits a phase transition at ca. 34 degrees C within a narrow temperature range. The first de-wetting transition takes place at 27 degrees C, which can be tentatively attributed to the n-cluster induced collapse of the inner region of poly(NIPAM) brush close to the silicon surface, the second de-wetting transition occurs at 38 degrees C. which can be attributed to the outer region of poly(NIPAM) brush, possessing much lower chain density compared to that of the inner part. (C) 2010 Elsevier B.V. All rights reserved.