Manufacturing low density boards from waste cardboards containing aluminium

Murathan A. M., Murathan A. S., Guerue M., Balbaşı M.

MATERIALS & DESIGN, cilt.28, sa.7, ss.2215-2217, 2007 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 28 Sayı: 7
  • Basım Tarihi: 2007
  • Doi Numarası: 10.1016/j.matdes.2006.06.014
  • Dergi Adı: MATERIALS & DESIGN
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED)
  • Sayfa Sayıları: ss.2215-2217
  • Gazi Üniversitesi Adresli: Evet

Özet

We tried to recycle waste Tetra Pak cardboards, which contain aluminium as a step in the prevention of the environmental pollution caused by municipal solid wastes and as methods of achieving economical worth from these. The composite prepared with urea-formaldehyde resin was harder relative to that prepared with polyvinyl acetate based glue. The target cardboard density and thickness were 0.5 g/cm(3) and 3.0 cm, respectively. We were unable to obtain information on the effect of matrix: resin ratio on hardness of materials. Samples were easily damaged by water, suggesting that these materials were not suitable for use in high-humidity media. (c) 2006 Elsevier Ltd. All rights reserved.