An Investigation of Adhesion Performance Under Various Conditions Using Heat-Treated Wood


ALTUNOK M.

JOURNAL OF POLYTECHNIC-POLITEKNIK DERGISI, cilt.24, sa.2, ss.711-714, 2021 (ESCI) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 24 Sayı: 2
  • Basım Tarihi: 2021
  • Doi Numarası: 10.2339/politeknik.762887
  • Dergi Adı: JOURNAL OF POLYTECHNIC-POLITEKNIK DERGISI
  • Derginin Tarandığı İndeksler: Emerging Sources Citation Index (ESCI), TR DİZİN (ULAKBİM)
  • Sayfa Sayıları: ss.711-714
  • Gazi Üniversitesi Adresli: Evet

Özet

In this study, the adhesion performance of oak (Quercus petrea Liebl.) And Scotch pine (Pinus Silvestris L.) wood samples that were heat treated and glued with 1K-PUR adhesive were kept under different conditions (A1-A4-A5) and moisture contents (20 degrees C /% 35, 20 degrees C /%65 ve 20 degrees C /% 95), and then the adhesion performance was investigated. Rough sized pieces of both types of wood were heat treated at 195 degrees C for 2 hours. Test samples were prepared from untreated and heat treated blanks (DIN EN 204). Tensile tests according to DIN EN 204 were applied to samples kept at 20 degrees C/35%, 20 degrees C/65% and 20 degrees C/95% temperature and relative humidity, respectively, and the adhesion performance was determined in three climatic conditions. At the end of these tests, it was found that the holding environment and climatic conditions have a significant effect on the adhesion resistance. It was observed that the samples that were kept under A1 conditions and tested had wood rupture (error) between 70% and 100%, and the samples tested after holding in A4 and A5 conditions mostly broke off from the glue joint.