Akademik Veri Yönetim Sistemi
4 th International Conference on Light and Light-based Technologies (ICLLT), Ankara, Türkiye, 16 - 18 Mayıs 2024, cilt.1, ss.61
In this research, the fabrication of flexible interdigital Ag electrodes, which
play an important role in the production of semiconductor devices such as
photodetectors and sensors, is investigated. In the study, both Aerosol jet printing and
thermal evaporation methods were used to fabricate interdigital Ag electrodes on three
different substrates (ITO, PET, and Kapton). After fabrication, the electrodes were
annealed at varying temperatures (150°C, 175°C, and 200°C) for 60 minutes.
Subsequently, a comprehensive analysis was performed to evaluate the optical and
electrical properties of the fabricated electrodes, using optical microscopy and IV
characterization techniques. In addition, the adhesion properties were carefully studied
through tape testing to measure the electrode-substrate bond strength. Finally, a
comparative evaluation was performed to understand the advantages and
disadvantages of the two different fabrication techniques. This study provides useful
information to improve our understanding of flexible electrode fabrication processes as
well as to optimize the performance of semiconductor devices in various applications
using the latest printing method. After annealing, all samples fabricated using both
methods exhibited improved resistivity, indicating enhanced conductivity and stability.
Such improvement in resistivity suggests better charge transport characteristics within
the electrodes, which is crucial for the performance of semiconductor devices like
photodetectors and sensors.