Thermal analysis of a refrigeration system integrated with a thermoelectric couple and microchannels using TiO2-water nanofluid


Elibol E. A., YILMAZOĞLU M. Z., AKSOY E., AKTAŞ F.

International Journal of Heat and Fluid Flow, cilt.108, 2024 (SCI-Expanded) identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 108
  • Basım Tarihi: 2024
  • Doi Numarası: 10.1016/j.ijheatfluidflow.2024.109491
  • Dergi Adı: International Journal of Heat and Fluid Flow
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Academic Search Premier, PASCAL, Aerospace Database, Applied Science & Technology Source, Chimica, Communication Abstracts, Compendex, Computer & Applied Sciences, INSPEC, Metadex, Civil Engineering Abstracts
  • Anahtar Kelimeler: Electronic cooling, Heat rejection, Microchannel, Nanofluid, Thermoelectric couple
  • Gazi Üniversitesi Adresli: Evet

Özet

Advances in chip technology lead to increased energy consumption due to larger chip capacities and, as a result, intense heat flux generation, resulting in the need for more robust cooling solutions. These solutions include fan-only systems, fan-conventional heat sink (HS) integrated systems, and fan-conventional HS-heat pipe (HP) integrated systems. While thermoelectric couples (TECs) offer benefits like compactness and noise-free operation, they alone cannot sufficiently cool sophisticated chips. Combining TECs with microchannel heat sinks (MCHS) and superior fluid utilization is essential for faster and more efficient cooling. Notably, this study is the first to explore a TEC integrated with two MCHSs, using a TiO2/water nanofluid to optimize the performance of this miniature refrigeration system. Herein, an experimental study was carried out to evaluate the thermal performance of the proposed cooling system at various volume flow rates using both TiO2-water nanofluid and pure water for comparative purposes. The results were interpreted in terms of Reynolds number, Prandtl number, heat transfer rate, Nusselt number (Nu), total thermal resistance, and the coefficient of performance (COP). In both MCHSs, the Nu exhibited an upward trend as the flow rate increased from 9 × 10−5 m3/s to 16 × 10−5 m3/s, independent of concentration. At 16 × 10−5 m3/s, the highest flow rate investigated, it was observed that as φ increased from 0 % to 0.03 %, the Nu for the first control volume increased from 47.17 to 47.32, while the Nu for the second control volume decreased from 46.43 to 46.23. Additionally, as φ increased from 0 % to 0.03 %, accompanied by a reduction in flow rate from 16 × 10−5 m3/s to 9 × 10−5 m3/s, the experimental COP rose from 0.325 to 0.853. The results indicate that the proposed refrigeration system in this study is promising for electronic circuit cooling applications, particularly at low flow rates and high nanoparticle volume concentrations.