Investigation of The Joining Interface of Copper-Titanium Bimetallic Composite Materials Manufactured Using Explosive Welding Method


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YILDIRIM M. S., Kaya Y.

JOURNAL OF POLYTECHNIC-POLITEKNIK DERGISI, cilt.27, ss.47-58, 2024 (ESCI) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 27
  • Basım Tarihi: 2024
  • Doi Numarası: 10.2339/politeknik.1091491
  • Dergi Adı: JOURNAL OF POLYTECHNIC-POLITEKNIK DERGISI
  • Derginin Tarandığı İndeksler: Emerging Sources Citation Index (ESCI), TR DİZİN (ULAKBİM)
  • Sayfa Sayıları: ss.47-58
  • Anahtar Kelimeler: Copper, titanium, explosive welding, joining interface, STAINLESS-STEEL, MECHANICAL-PROPERTIES, MICROSTRUCTURE, JOINTS, WELDABILITY, MORPHOLOGY, CORROSION, ALUMINUM, PLATES, GRADE
  • Gazi Üniversitesi Adresli: Evet

Özet

In this study, copper (Cu) and titanium (Ti)plates were joined by explosion welding method using different explosive rates and Cu-Ti bimetallic composite materials were produced. The effect of explosive rate on the bonding interface of the produced Cu-Ti bimetallic composite materials was invistigated by microstructure studies and mechanical tests. Optical microscope (OM), scanning electron microscope (SEM), energy dispersive spectrometry (EDS) and X-ray diffraction (XRD) methods were used for the joining interface characterization. In order to determine the mechanical properties of the joining interface, tensile-shear, notch impact, bending, twisting tests and microllardness studies were carried out. As a result of the microstructure investigations, it was determined that as the exposive rate increased, the fluctuation at the bonding interface increased and accordingly, the wavelength and amplitude increased. In addition, it was determined that Cu4Ti and Cu4Ti3 intermetallic phases were formed at an explosive rate of R=3, and intermetallic phases of Cu3Ti2, Cu4Ti3, CuTi2 and CuTi3 at an explosive rate of R=3.5. As a result of the mechanical tests, it was determined that there was no visible welding defect at the bonding interface.