Akademik Veri Yönetim Sistemi
JOURNAL OF THE FACULTY OF ENGINEERING AND ARCHITECTURE OF GAZI UNIVERSITY, cilt.39, sa.4, ss.2617-2630, 2024 (SCI-Expanded)
In this study, AFT (Air Flow Through) cooling method, which is one of the module level cooling methods of
printed circuit boards with high power consuming electronic components, is investigated. This method for cooling
electronic components was designed based on the ANSI/VITA 48.8-2017 standard and has been successfully
implemented. The plug-in module, which serves as a heat sink, is suitable for a 3U (100*1600mm) form factor.
Within the scope of the study, plate-type fins with rectangular cross-section were used. The purpose is to observe
the effects of different fin heights due to the use of different pitches on the cooling performance and flow dynamics
of the module. In this context, three-dimensional numerical analysis studies were carried out using the FLOEFD
package program. The changes in the thermal resistance, pressure drop and average Nusselt number of the module
are analyzed under three different fin heights. Experimental studies were carried out to validate the numerical
model on which the analyses were performed. Air at 25℃ inlet temperature and 1900 ≤ Re ≤ 11700 was used at
the air inlet side of the module under a continuous heat load of 100 W. As a result, it was found that the extra heat
transfer area provided by increasing the fin height on the module contributed positively to the thermal performance
of the module. At the same inlet velocities, 43% lower surface temperature was obtained on the module surface
with 1,5 inch pitch. The difference between the data obtained from the experimental studies and the numerical
simulation results varied between 5.9% and 10%.