Research Information System
3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, New York, United States Of America, 28 - 30 September 1998, pp.90-95
In order to gain insight into the film thickness dependent conduction behavior of adhesives containing conductive particles of different size, shape and type, the effect of adhesive film thickness was studied. Epon 830 resin was used as the base resin, and 4-7 mu m silver powder was used as the base particle for comparative purposes. Adhesive films of length 2.0 cm, and width 0.7 cm were cast subsequent to mixing with conductive particles in the amount 25% by volume. The conductive particles were 100% Ag or 50% by weight mixture of Ag with Ni powder, flakes, or filaments. Silver coated Ni flakes of size 20 mu m were also mixed in 50% proportion with Ag powder to assess the effect of silver coating. Subsequent to cure, the resistance of the filled films were measured by the four-point method, and resistivities calculated based on these measurements.