Thickness dependent conduction behavior of various particles for conductive adhesive applications


Sancaktar E., Dilsiz N.

3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, New York, United States Of America, 28 - 30 September 1998, pp.90-95 identifier identifier

  • Publication Type: Conference Paper / Full Text
  • Volume:
  • Doi Number: 10.1109/adhes.1998.742008
  • City: New York
  • Country: United States Of America
  • Page Numbers: pp.90-95
  • Gazi University Affiliated: No

Abstract

In order to gain insight into the film thickness dependent conduction behavior of adhesives containing conductive particles of different size, shape and type, the effect of adhesive film thickness was studied. Epon 830 resin was used as the base resin, and 4-7 mu m silver powder was used as the base particle for comparative purposes. Adhesive films of length 2.0 cm, and width 0.7 cm were cast subsequent to mixing with conductive particles in the amount 25% by volume. The conductive particles were 100% Ag or 50% by weight mixture of Ag with Ni powder, flakes, or filaments. Silver coated Ni flakes of size 20 mu m were also mixed in 50% proportion with Ag powder to assess the effect of silver coating. Subsequent to cure, the resistance of the filled films were measured by the four-point method, and resistivities calculated based on these measurements.